Leading 21-inch Open Liquid-Cooled Rack Solution for AI Computing Infrastructure (Made in Taiwan)
With the continuous growth of Artificial Intelligence (AI), High Performance Computing (HPC), and cloud service demands, data center infrastructure is evolving toward higher power density and greater energy efficiency. The open hardware architecture promoted by the Open Compute Project (OCP) has also made OCP racks (Open Rack) gradually become one of the common rack design standards in hyperscale data centers.
EA-HWA has been deeply engaged in the Taiwan rack market and OEM sheet metal industry for more than 30 years, providing rack products and installation positioning services for telecommunications rooms, computer rooms, data centers, and data center projects for various brands. In addition to supporting the design and manufacturing of rack enclosures compliant with ORv3 specifications, EA-HWA also has production and shipping capabilities in both Taiwan and Mainland China, offering more diverse production options for liquid cooling integrators and cloud service providers.
The SR series racks can provide standard racks or customized rack configurations according to project requirements and are suitable for application scenarios such as AI server clusters, cloud computing platforms, and high-density data center infrastructure.
Deconstructing OCP Open Rack: Why It Has Become a Common Architecture in Modern Data Centers
The Open Compute Project (OCP) is an open data center hardware standard initiative launched by Meta (Facebook) in 2011, aiming to improve overall computing efficiency, energy efficiency, and hardware interoperability through redesigning data center equipment architecture. As AI, cloud computing, and high-performance computing (HPC) demands continue to grow, the Open Rack architecture proposed by OCP has gradually become one of the common rack design directions in hyperscale data centers.
Compared with traditional 19-inch EIA-310 racks, OCP Open Rack is not merely an adjustment of rack dimensions, but is based on the “Grid to Gates” design philosophy, optimizing from the power grid end (Grid) all the way to the computing core (CPU/GPU), redefining the integration of power and mechanical structures in data centers.
OCP Open Rack adopts a 21-inch equipment width. Compared with traditional 19-inch racks, it provides more installation space, which helps to:
- Increase equipment deployment density
- Enhance airflow channels for cooling
- Improve thermal management for high-power devices
This design is particularly suitable for AI GPU servers and high-density computing nodes.
OCP uses OpenU (OU) as the rack height unit:
1 OU = 48 mm
Compared with traditional U units, the OU design improves space utilization efficiency and offers the following advantages:
- Increased equipment density within the rack
- Optimized airflow management paths
- Improved overall cooling efficiency
The OCP Open Rack architecture follows the Grid to Gates design philosophy, integrating the power system from the data center grid end to internal server components, forming a complete power transmission chain.
Typical architecture includes:
- Power Shelf
- Busbar
- Server Power Distribution
- Rack-Level Power Architecture
This centralized power architecture helps reduce multiple power conversion losses and improves overall energy efficiency.
Based on the above design, OCP Open Rack represents not only a change in rack dimensions but also a systematic optimization of data center infrastructure. In practical applications, it is mainly reflected in the following aspects:
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Optimized airflow and thermal management
Adjustments in rack width and internal layout reduce airflow dead zones and enhance cooling support for high heat-density equipment such as GPU servers.
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High-efficiency power distribution
Combined with the Busbar design in ORv3 architecture, power distribution becomes more centralized, reducing energy loss during conversion.
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Reduced Total Cost of Ownership (TCO)
Standardized modules and rack-level integration simplify large-scale deployment and maintenance processes, thereby reducing long-term operational costs.
The EA-HWA SR Series 21-inch OCP ORv3 rack is designed based on the above Open Rack architecture and in accordance with ORv3 specifications. The product aligns with OCP equipment integration requirements in terms of dimensions, structure, and installation configuration, and supports deployment planning for AI servers, high-density computing, and liquid-cooled data center environments.
Through standardized and modular design, the SR series assists system integrators and data center planners in achieving more flexible rack configurations and overall system integration when adopting OCP architecture.
OCP ORv3 (Open Rack Version 3) is currently the latest generation rack standard of OCP, designed specifically for AI/HPC high power density computing environments.
ORv3 is commonly paired with a 48V DC power distribution architecture, effectively reducing energy loss and improving power efficiency.
Designed to support higher power density server equipment such as GPU computing nodes.
- Integration with liquid cooling systems
- Reserved space for manifolds
- Integration of cooling systems
Comparison between ORv3 and earlier ORv1 / ORv2:
| Item | ORv1 (Approx. 2011–2013) | ORv2 (Approx. 2013–2022) | ORv3 (From 2022, Current Mainstream) | Key Upgrade Highlights (ORv3 vs. Previous Gen) |
|---|---|---|---|---|
| Total External Width | 600mm | 600mm | Option 1: Approx. 600mm (Meta) Option 2: Approx. 706mm (Google) |
Consistent sizing, high compatibility. |
| Total External Depth | 1067mm | Mainstream: 1067mm Shallow: 762mm (30″) |
Flexible depth. Meta: 1068mm Google: 805.2mm / 1219mm |
More flexible; supports deep AI racks and rear cable management. |
| Total External Height | 2100mm | 2210mm | 2286mm (44 OU / 47 OU) | Supports liquid cooling technology and convenient maintenance. |
| Payload Capacity | 850 kg | 500 kg (Base) / 1400 kg (Heavy Duty) |
1400 kg (Base) / 1600 kg (Heavy Duty) |
Better suited for high-load requirements. |
| Entry/Exit Angle | 10-degree ramp capability | 15-degree entry/exit angle | 10-degree entry / 15-degree exit | Ensures physical safety and structural durability during transport. |
| Standard DC Voltage | 12V DC (Nominal 12.5V) | 12V or 48V DC (Nominal 54.5V) | 48V / 54V DC | Supports high-power requirements. |
| Power Zone Architecture | 3 Independent Power Zones | Multiple zones (Centralized power shelf concept) |
Single Power Zone | Higher efficiency, lower loss. Breaks spatial limits on power; supports loads over 30kW with high customizability. |
| Power Shelf Rating | 4.2 kW, | Mostly 12-13kW (Depending on configuration) |
15 kW ~ 18 kW (Standard), expandable to 36 kW+ |
Significant boost for AI training. |
| Power Shelf Placement | Fixed at the bottom of each zone | Fixed position | Any OU slot within the rack | Flexible placement of power components, improving installation convenience. |
| Input Power Config | Distributed PDU | Requires gPDU (Global PDU) |
Universal input connector (No gPDU required) |
Eliminates single points of failure; globalizes supply chain. |
| IT Device Input Current | Approx. 80A per node (12V) | Depends on voltage version | 100A continuous current | Supports high-power operation per node; meets future product demands. |
| Busbar / Connector | Simpler, 75A grade | 48V busbar, but connector was weaker | New blind-mate connector: 100A continuous, additional Power Sense / Ground Sense lines | Arcing prevention (mate-last / break-first); supports voltage drop monitoring. |
| Power Sequencing | Daisy-chain monitoring for fault signals. Minimal active sequencing. | Short Pin: Control via physical contact sequence: Return > Power > Short Pin. | Power Sense: Active control of power circuit, ensuring power only flows after full insertion. | Prevents arcing damage under high current; enhances hot-plug reliability. |
| Busbar Design | 3 pairs of 12V busbars per zone | 12V or 48V vertical busbars | 48V centralized busbar | Arcing prevention (mate-last / break-first); supports voltage drop monitoring. |
| Liquid Cooling Support | None | None | Supports spec-compliant liquid manifolds; directly installable via optional kits. | Integrated liquid cooling manifolds; easier connection to cooling loops. |
This product breaks the international 19-inch rack standard and adopts a 21-inch equipment width specification. In the transformation of modern data centers, it has become synonymous with high efficiency and high-density architecture. Understanding whether your equipment is compatible with the ORv3 rack, as well as how to evaluate the data center environment, is one of the options for improving operational efficiency (OPEX).
IT Gear (such as servers, storage devices, network equipment, and power modules) designed and manufactured in accordance with the OCP Open Rack specification. This hardware typically features the advantage of tool-less installation, allowing direct slide-in and latch mounting.
- Covered categories: Compute servers, storage nodes, network switches, and power shelves.
- Mainstream brands: Including Quanta (Quanta/QCT), Wiwynn, Foxconn, Giga Computing, Inventec, and other products specifically designed for OCP applications.
- Core advantage: Supports “blind-mate” design, significantly reducing on-site maintenance and component replacement time.
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The most commonly available equipment on the market compliant with the EIA 19-inch standard (such as servers and networking equipment), due to its narrower width compared to the 21-inch OCP specification, cannot be directly locked and fixed onto the left and right equipment mounting posts during installation. Additionally, the rack mounting hole specifications are different from the EIA standard, resulting in misalignment in compatibility. Forcing installation may instead affect structural stability.
Are you experiencing concerns about this situation?
The thoughtful solution from EA-HWA is that we have also developed optional accessories that allow EIA 19-inch equipment to be mounted in parallel. After installation, it can be converted into RU-based configuration, enabling seamless mixed usage of 19-inch equipment and providing a smooth transition solution between legacy and new systems.
19-inch Adapter Brackets
EA-HWA offers the following optional adapter accessories for selection:
» 19-inch half-height adapter bracket
» 19-inch 1U adapter bracket
» 19-inch 2U adapter bracket
- Limitation: Width and mounting hole specifications are different.
- Solution: If mixed usage is required, it is necessary to confirm whether it is an ORv3-supported version or to additionally purchase dedicated 19-inch adapter bracket accessories.
Under the rapid development of AI servers, high-density computing, and hyperscale data centers, rack architectures compliant with Open Compute Project standards have become a key choice for global cloud service providers and system integrators.
The OCP ORv3 rack（Open Rack Version 3）produced by EA-HWA is designed specifically for next-generation server equipment, fully supporting 21-inch OCP devices and 48V power systems. With high compatibility and flexible customization capabilities, this OCP rack not only meets modular mass production needs but also adapts quickly to different data center planning requirements.
EA-HWA SR Series is designed specifically to meet the high power consumption requirements of AI servers. The rack chassis strictly complies with OCP ORv3 physical specifications, ensuring zero-gap, seamless interoperability with global OCP ecosystem equipment (including OCP servers from Quanta, Wiwynn, GIGABYTE, Ingrasys, etc.), enabling plug-and-play deployment.
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Modular Power Expansion
The rack provides reserved standard mounting holes and installation space, allowing customers to easily add a 48V DC Busbar according to actual power requirements and secure it quickly without complex modifications. This enables support for VHP high-power systems.
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High Load-Bearing Structural Engineering
Designed for AI high-density GPU server environments, the rack’s overall load capacity exceeds 1400 KGS, maintaining structural stability even under full load conditions, perfectly meeting the load-bearing and safety requirements of modern hyperscale data centers.
With the continuous increase of AI chip TDP, EA-HWA SR Series provides highly flexible rack thermal management customization services. It is an ideal solution for Liquid-to-Air or Direct-to-Chip (D2C) cooling systems, enabling optimized PUE performance with improved energy efficiency and environmental sustainability.
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Precision Laser Cutouts and Spatial Configuration
We provide professional mechanical co-design services, offering highly flexible mass customization for different liquid cooling manifold (water inlet/outlet) routing or air-cooling airflow channel requirements. Precision laser-cut openings reduce the need for secondary processing on-site, minimizing construction risks.
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Compatibility with 21-Inch and 19-Inch Servers
To achieve integration of equipment with different widths across legacy and modern systems, the EA-HWA SR Series features a 21-inch OCP width design and offers optional 19-inch adapter racks (EIA Adapter). This allows enterprises to deploy both traditional 19-inch equipment and 21-inch OCP equipment within the same rack, enabling cross-generation system transition or expansion at minimal cost while preserving existing asset investments.
Stability has been the core of the EA-HWA brand for over 30 years. We go beyond compliance with standards and pursue the ability to protect equipment within racks under vibration and seismic environments, ensuring stable data transmission performance. We are committed to contributing to seismic protection and safety for data centers located in earthquake-prone regions.
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Authoritative Third-Party Testing
EA-HWA manufacturing team was commissioned by an international client to send a fully loaded 52U rack to the National Center for Research on Earthquake Engineering (NCREE) for testing under the stringent GR-63-CORE Zone 4 (highest seismic level) certification. After extreme seismic simulation at the highest intensity level, the installed equipment remained securely fixed within the rack. This serves as a reference for selecting load-bearing and vibration-resistant products, ensuring that during seismic events, your critical equipment receives reliable physical buffering and protection.
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Tool-Less Maintenance and Disassembly
In response to OCP rack requirements and the need for high-density server installation, EA-HWA provides tool-less quick-release brackets designed to accelerate equipment installation and removal. This reduces data center operational expenditure (OPEX) and improves Mean Time to Repair (MTTR). In highly competitive AI environments, maintenance speed directly determines long-term operational efficiency and service quality.
Technical Specification
| Features | EA-HWA SR Series OCP ORv3 Specification | Advantages |
|---|---|---|
| Compliance | OCP Open Rack V3 (Standard Base) | Seamless compatibility within the global ecosystem. |
| Power Support | 48V VHP Busbar (Optional / Lockable Type) | Supports high-wattage AI computing nodes. |
| Vibration Resistance | Standard rack passed vibration testing Past projects assisted partners in passing anti-vibration testing |
Through iterative experience in past developments, EA-HWA enables you to create next-generation products with enhanced advantages. |
| Thermal Management Design | Supports customized cutouts for liquid cooling manifold | Compatible with air cooling, liquid cooling, and hybrid thermal solutions. |
| Structural Dimensions | 21-inch (Native) / 19-inch (via adapter) | Balances OCP innovation with legacy equipment compatibility. |
| Manufacturing Capability | 30 years of precision manufacturing + optimized anti-corrosion coating | Long-term commitment to durability and high quality. |
Locally manufactured in Taiwan (MIT), supporting flexible production for medium-volume demand of 100–500 units. EA-HWA emphasizes intellectual property protection and high-quality transaction services, and maintains a professional approach with strict production control to ensure project execution success. We aim to be your long-term trusted partner.
- Taiwan local manufacturing (MIT), fast delivery with technical responsiveness
- Years of experience in data center rack production
- Balance of product cybersecurity and quality assurance
The stable Taiwan-based supply chain enables accelerated production in response to confirmed customer orders, offering significantly greater delivery flexibility compared to overseas manufacturers:
- Emergency adjustment support
- Optimized shipping schedules
- Precise customization implementation
Internal static load capacity reaches over 1400 kg, easily supporting OCP-related equipment configurations, including:
- AI GPU Server
- High-performance computing equipment
- Data center deployment
The standard anti-corrosion process uses RoHS-compliant powder coating. The average coating thickness reaches 60μm. Testing confirms that black steel sheets treated with our surface finishing process pass a 48-hour salt spray test, enabling high cost-performance procurement of racks suitable for global markets with zero complaint expectations. For mass production requirements, optimized anti-corrosion coating solutions can be provided according to island climate conditions or specific industrial environments.
- RoHS-compliant powder coating process
- Average coating thickness of 60μm
- Passed 48-hour salt spray test
From cutout positioning, structural reinforcement to accessory development, EA-HWA provides one-stop brand customization services. We are capable of transforming OCP standards into physical rack systems that best match your equipment requirements. For customers requiring deep optimization and iterative upgrades of specific hardware architectures, EA-HWA is your preferred partner.
- Rack structure optimization
- Cutout and thermal design
- Modular accessory development
Rooted in Taiwan with a dual-track manufacturing strategy, EA-HWA operates production facilities in Taiwan while also providing production line support through its subsidiary in mainland China, enabling flexible response to regional manufacturing and export requirements. We not only provide professional technical support but also possess large-scale mass production capabilities:
- Rapid technical response
- Stable mass production capability
- China-based manufacturing support
Product Specification Summary Table
| Item | Specification Description |
|---|---|
| Model | SR Series OCP ORv3 Rack |
| OU Count | 44OU |
| External Dimensions | Width 600mm × Height 44OU × Depth 1068mm |
| Load Capacity | 1400 kg or more |
| Compliance Standard | OCP Open Rack V3 Base Specification |
| Power Architecture | Supports optional 48V Busbar add-on; compatible with high-power VHP systems |
| Cooling Compatibility | Rack frame does not include air-cooling/liquid-cooling equipment; We provide specialized mounting kits to install standard Liquid Cooling Manifolds at the rear of the rack. Alternatively, we offer precision rack customization tailored to your specific Manifold, Blind Mate connector, and CDU system requirements. |
| Equipment Compatibility | Designed to house standard OCP 21″ equipment, with the flexibility of optional 19″ EIA adapter brackets to support legacy hardware. |
| Surface Treatment | Complete pre-treatment process to enhance adhesion and rust resistance, ensuring the finished product is resistant to peeling |
| Manufacturing Experience | 30 years of experience in cabinet and rack manufacturing; primarily Taiwan-based supply chain; certified to ISO9001, ISO14001, ISO27001; NDA can be signed upon mutual agreement to protect your intellectual assets; structural strength rigorously tested, supports heavy-duty casters and leveling feet |
The ORv3 design is intended to meet the requirements of high-voltage power distribution and ultra-high-density deployment. The following environments can fully leverage its advantages:
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AI Training Clusters
ORv3 is the preferred choice for high-performance GPU servers (such as the NVIDIA Blackwell platform), capable of supporting extremely high power demands and advanced thermal configurations.
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Hyperscale Data Centers
For cloud service providers (CSPs) operating thousands of racks, the standardized OCP design significantly maximizes operational efficiency.
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Fully Liquid-Cooled Facilities (Cold Plate / Immersion Cooling)
Reserved manifold space for liquid cooling enables a more streamlined and efficient cooling system deployment.
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Modern High-Load Data Centers
Recommended floor loading capacity should reach 1800 kg/m² or higher to accommodate fully loaded rack weights.
In certain legacy or constrained environments, forcibly introducing OCP ORv3 racks may lead to increased construction costs. It is recommended to avoid or carefully reassess the following scenarios:
| Environment Type | Challenges and Risks |
|---|---|
| Brownfield / Legacy Data Center Renovation | Shallow raised floors or legacy 600x600mm floor tile layouts often conflict with ORv3 cable routing and airflow design. |
| Low Load-Bearing Floors | Fully loaded OCP racks are significantly heavy; older building structures may not be able to support the load. |
| Edge Computing and Small Server Rooms | High equipment heterogeneity and limited power availability (lack of 48V support) make it difficult to realize OCP scale efficiency. Multi-vendor environments also increase operational complexity; in such cases, ORv3’s open architecture and high-power design may be less suitable compared to traditional 19-inch racks. |
| Logistics-Constrained Facilities | Due to the increased height of OCP racks, it is necessary to confirm whether the facility’s freight elevator height is sufficient in advance. |
— EA-HWA is not just a rack provider, but a partner in your project success. —
OCP ORv3 vs 19-Inch Rack System Comparison
Traditional 19-inch racks (EIA-310) remain a long-standing industry standard; however, in hyperscale cloud architectures, their limited width has become a bottleneck for both thermal performance and space density.
The emergence of OCP ORv3 represents the full implementation of an “Ethos of Efficiency.” Within the same 600mm external footprint, ORv3 increases equipment width to 21 inches, achieving maximum compute density while eliminating complex cabling through the adoption of centralized power distribution via busbar systems.
The following table provides a summary comparison of the core differences between 19-inch racks and OCP ORv3 systems, enabling a clear understanding of key distinctions:
| Item | 19-inch Rack (EIA-310) | OCP ORv3 Rack (Open Rack V3) | Main Differences & ORv3 Advantages |
|---|---|---|---|
| Equipment Width | 19 inches (483 mm) front panel width, internal usable approx. 17.7 inches (450 mm) | Designed for rapid 21” OU equipment deployment. (Available in two standard internal widths: 539mm / 610mm) |
ORv3 provides approx. 15% more installation width, better airflow, cable management, and higher component density |
| Vertical Unit Height | RU (Rack Unit) = 44.45 mm (1.75 inches) | OU (OpenU) = 48 mm (1.89″) Optional RU compatibility mode supported |
The increased height of ORv3 (48mm vs. 44.45mm) provides greater vertical clearance for internal heatsinks and fans, significantly optimizing airflow. Additionally, this extra 3.55mm ensures ample rear space for complex blind-mate interfaces and cable management. |
| External Rack Width | Approx. 600 mm (including side panels/doors) | Option 1: 600 mm Mainstream Width (Legacy compatibility) Option 2: Open Configuration (Optimized for ultra-high power demands) |
Similar width planning ensures seamless compatibility with existing data center layouts. |
| Depth | Common 600–1200 mm, mostly 800–1000 mm | Mainstream Depths: 1068 mm / 1219 mm (48″) | The exterior specifications are not strictly mandated and can be adjusted based on actual requirements; the current ORv3 depth refers to the definitions established by Meta and Google. |
| Power Density | Typical: 3-10kW (Customizable for higher density and power.) |
Base power is defined as approximately 15 kW to 18 kW (N+1) per power shelf, and can reach 36 kW+ with multiple shelves in parallel. | Through 48V centralized power supply, ORv3 increases power density by more than 2–4 times, specifically designed for AI training and inference. |
| Power Architecture | Individual AC power supplies + rack PDU | 48V DC busbar (central Power Shelf conversion) | Higher efficiency (reduced conversion losses), blind-mate connection, no AC-DC conversion inside servers |
| Connection Method | Traditional power cords, network cables, manual plugging/unplugging | Rear blind-mate busbar + Power Sense / Ground Sense arc prevention | Safer hot-plug, faster installation, significantly reduced cabling |
| Cooling Support | Primarily air cooling (front-to-rear airflow), liquid cooling requires additional modification | By using an installation kit, a manifold manufactured to specifications can be mounted at the rear of the rack. | ORv3 is optimized for high-power AI liquid cooling, establishing manifold specifications to support future installation requirements. |
| Structure Type | Mostly enclosed cabinet (with doors/side panels) | Open frame design to enhance space utilization (EA-HWA offers optional doors and side panels) |
ORv3 provides stronger support for high-load structures |
| Compatibility | Standardized, supports nearly all enterprise servers/network equipment | 21″ OU equipment manufactured according to OCP specifications; Optional adapter brackets available for installing 19″ RU equipment. |
Backward compatible with legacy equipment, most friendly transition |
| Application Scenarios | Enterprise, small/medium data centers, telecom, general-purpose servers | Hyperscale and AI/HPC large-scale clusters | ORv3 optimized for high-density, high-efficiency AI era |
| Space Efficiency | Approx. 73% (after accounting for side panels and rail losses) | Approx. 87.5% (full 21-inch equipment bay utilization) | ORv3 significantly improves rack space utilization rate |
| Maintainability | Rear access for power/cables more common | Front-access Power Shelf with front-loading/unloading battery + Rear blind-mate design | ORv3 enables “Front-End Maintenance,” allowing technicians to complete all module replacements from the front without going to the rear of the rack. This significantly improves overall maintainability and reduces downtime. |
FAQ
Q1: Is the SR Series a standalone OCP rack frame, or is it an integrated system that already includes internal equipment, cabling, and power capacity & bus bar infrastructure (Power Capacity & Bus Bar)?
A1: The SR Series is sold as an OCP rack enclosure (empty cabinet only). The standard configuration does not include internal power equipment. If a 48V Busbar is required, it can be provided as an optional add-on purchase.
Q2: Is customization available, such as custom cable routing cutouts or mounting holes?
A2: If your order quantity meets the MOQ requirement, customized production can be performed according to your drawings and specifications.
Q3: What OCP rack accessories are available as optional configurations?
A3: Quick-release brackets, 19” adapter frame – half rack, 19” adapter frame – 1U, 19” adapter frame – 2U, front door, side panels, anti-seismic support bars, busbars, liquid cooling extension frame, heavy-duty caster set.
Q4: From which regions can shipments be arranged when working with EA-HWA?
A4: Products manufactured in Taiwan will be shipped from Changhua, Taiwan.
Products manufactured in China will be shipped from Kunshan, China.
Q5: Are the products shipped assembled or as flat-pack components?
A5: The SR Series structure is welded and is delivered as a fully assembled unit.
Q6: How can I request a quotation from EA-HWA?
A6: Please confirm your required specifications, quantity, and any optional accessories, and submit your inquiry through the official website contact form:
https://www.ea-hwa.com.tw/contactus.html
A dedicated representative will follow up with you shortly.
If you require customized specifications or logo branding, please also provide the relevant drawings for faster evaluation.
If no specific color is requested, the rack frame will be finished in standard black powder coating.
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